Title: CO-PACKAGED OPTICAL TRANSCEIVERS FOR HPC, DATA CENTER AND AI APPLICATIONS Abstract: This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems. About the Speaker: Daniel M. Kuchta (IEEE Fellow 2019) is a Principal Hardware System Architect at Nvidia. Previously he was a R…
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